KB番号:050
概要説明:高温+応力による集積回路(パッケージ製品)の膨張
ストレス大分類:温度+応力
ストレス小分類:高温+応力
故障メカニズム大分類:膨張
故障メカニズム小分類:ポップコーン現象
故障フェーズⅠ:水分気化
故障フェーズⅡ:膨張
故障モード:
アイテム:集積回路(パッケージ製品)
故障の発生原理:
故障モードの検出:SEM?
SEM
走査型電子顕微鏡(Scanning Electron Microscope)
主な業界・分野:電子デバイス
抑制対策(再発防止策):
抑制対策(評価基準):
備考:
website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website website